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| EC1089 Product Features x x x x x x 10 - 2500 MHz +24 dBm P1dB +41 dBm OIP3 15.5 dB Gain at 900 MHz 12.2 dB Gain at 1900 MHz Available in SOT-89 and lead-free / green SOT-89 Package Styles x Internally matched to 50 : The Communications Edge TM Product Information InGaP HBT Gain Block Product Description The EC1089 is a high dynamic range driver amplifier in a low-cost surface mount package. The InGaP/GaAs HBT is able to achieve high performance across a broad range with +41 dBm OIP3 and +24 dBm of compressed 1dB power. It is housed in an industry standard SOT-89 SMT package. The EC1089 is also available in a lead-free/green/RoHScompliant SOT-89 package. All devices are 100% RF and DC tested. The EC1089 is targeted for use as a driver amplifier in wireless infrastructure where high linearity and medium power is required. An internal active bias allows the EC1089 to maintain high linearity over temperature and operate directly off a single +5 V supply. This combination makes the device an excellent candidate for transceiver line cards in current and next generation multi-carrier 3G base stations. Functional Diagram GND 4 1 RF IN 2 GND 3 RF OUT EC1089B / EC1089B-G Applications x Mobile Infrastructure x Final stage amplifiers for Repeaters x Defense / Homeland Security Specifications (1) Parameters Operational Bandwidth Test Frequency Gain Input Return Loss Output Return Loss Output P1dB Output IP3 (2) IS-95A Channel Power @ -45 dBc ACPR Typical Performance (3) Units MHz MHz dB dB dB dBm dBm dBm dB MHz dB dBm dBm mA V Min 10 10.5 Typ 1900 12.2 15 10 +23.5 +41 +17 5.9 2140 11.5 +23.5 +40 160 +5 Max 2500 Parameters Frequency S21 - Gain S11 - Input R.L. S22 - Output R.L. Output P1dB Output IP3 Noise Figure Supply Bias Units MHz dB dB dB dBm dBm dB Typical 900 1900 2140 15.5 12.2 11.5 -14 -15 -15 -10 -10 -10 +24 +23.5 +23.5 +40 +41 +40 5.1 5.9 5.4 +5 V @ 160 mA +40 Noise Figure Test Frequency Gain Output P1dB Output IP3 (2) Operating Current Range Device Voltage 3. Typical parameters reflect performance in a tuned application circuit: Supply Voltage = +5 V, I = 160 mA, +25 C 140 175 1. Test conditions unless otherwise noted: 25 C, Supply Voltage = +5 V, , in tuned application circuit. 2. 3OIP measured with two tones at an output power of +11 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. Absolute Maximum Rating Operating Case Temperature Storage Temperature RF Input Power (continuous) Device Voltage Device Current Junction Temperature Ordering Information Part No. EC1089B EC1089B-G EC1089B-PCB900 EC1089B-PCB1900 EC1089B-PCB2140 Parameter -40 to +85 qC -65 to +150 qC +18 dBm +6 V 220 mA +250 qC Rating Description (leaded SOT-89 Pkg) InGaP HBT Gain Block InGaP HBT Gain Block (lead-free/green/RoHS-compliant SOT-89 Pkg) 900 MHz Evaluation Board 1900 MHz Evaluation Board 2140 MHz Evaluation Board Operation of this device above any of these parameters may cause permanent damage. Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com December 2004 1/4 Watt, High Linearity InGaP HBT Amplifier S-Parameters (VDS = +5 V, Icc = 160 mA, T = 25 C, unmatched 50 ohm system) 1.0 EC1089 DB(|S[2,1]|) The Communications Edge TM Product Information Typical Device Data S11 6 0. 0.8 30 25 20 Gain (dB) 15 2. 0 0 3. 2. 0 DB(GMax) 0. 4 6 0. 0.8 1.0 Gain / Maximum Stable Gain S22 Swp Max 6GHz Swp Max 6GHz 0 4. 0.2 5 .0 10.0 10.0 0.2 0.4 0.6 0.8 1.0 2.0 3.0 4.0 .0 -2 0 0 0.5 1 1.5 Frequency (GHz) 2 2.5 .4 -0 .4 -0 -0 .6 .6 Swp Min 0.1GHz -0 - 0 2. Swp Min 0.1GHz -0.8 -1.0 -0.8 Notes: The gain for the unmatched device in 50 ohm system is shown as the trace in black color. For a tuned circuit for a particular frequency, it is expected that actual gain will be higher, up to the maximum stable gain. The maximum stable gain is shown in the dashed red line. The return loss plots are shown from 50 - 3000 MHz, with markers placed at 0.5 - 3.0 GHz in 0.5 GHz increments. S-Parameters (VDS = +5 V, IDS = 160 mA, T = 25 C, unmatched 50 ohm system, calibrated to device leads) Freq (MHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) -1.0 S22 (ang) 50 100 200 400 600 800 1000 1200 1400 1600 1800 2000 2200 2400 2600 2800 3000 -3.61 -3.31 -2.62 -2.62 -2.54 -2.39 -2.27 -2.21 -2.16 -2.05 -1.99 -1.84 -1.68 -1.46 -1.33 -1.20 -1.17 -169.14 -173.35 179.12 173.23 168.30 163.31 158.06 152.89 147.55 142.54 137.85 133.47 129.41 125.20 120.48 115.03 109.05 23.08 21.93 19.02 17.74 16.69 15.62 14.57 13.55 12.54 11.65 10.70 9.91 9.13 8.46 7.85 7.22 6.62 149.67 148.90 146.43 136.11 123.77 111.53 101.13 91.40 82.69 74.35 66.99 59.96 53.84 47.68 41.30 34.74 27.78 -30.46 -29.57 -27.97 -27.96 -27.96 -27.96 -26.02 -26.02 -26.02 -26.02 -25.08 -24.44 -24.44 -24.44 -23.27 -23.10 -23.10 17.14 14.05 9.40 10.86 10.86 10.62 9.88 8.87 7.57 5.95 4.22 2.37 0.24 -2.39 -5.53 -9.13 -12.86 -7.74 -7.80 -6.40 -6.33 -6.09 -5.86 -5.68 -5.58 -5.37 -5.20 -5.20 -5.05 -5.01 -4.89 -4.88 -4.73 -4.66 -128.38 -143.29 -169.43 -179.95 173.78 168.37 163.12 157.73 152.46 147.09 141.71 136.43 131.29 126.16 121.19 116.28 111.40 Device S-parameters are available for download off of the website at: http://www.wj.com Application Circuit PC Board Layout Circuit Board Material: .014" Getek, 4 layers (other layers added for rigidity), .062" total thickness, 1 oz copper Microstrip line details: width = .026", spacing = .026" Specifications and information are subject to change without notice December 2004 WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com -4 .0 -5. 0 -3 .0 -4 .0 -5 . 0 5 2 - 0. 2 -0. -10. 0 -10.0 10 5.0 0 10.0 0.2 0.4 0.6 0.8 1.0 2.0 3.0 4.0 5.0 0 0. 4 0 3. 4. 0 5.0 -3 .0 0.2 10.0 1/4 Watt, High Linearity InGaP HBT Amplifier Typical RF Performance Frequency S21 - Gain S11 - Input Return Loss S22 - Output Return Loss Output IP3 (+11 dBm / tone, 1 MHz spacing) EC1089 The Communications Edge TM Product Information CAP ID=C3 C=1e5 pF size 1206 CAP ID=C2 C=1000 pF size 0805 CAP ID=C1 C=56 pF 900 MHz Application Circuit (EC1089B-PCB900) Vcc = +5 V All passive components are of size 0603 unless otherwise noted. 900 MHz 15.5 dB -15dB -10 dB +40 dBm +24 dBm 5.1 dB +5 V 160 mA RES ID=L2 R=2700 Ohm DIODE1 ID=D1 5.6 V Output P1dB Noise Figure Supply Voltage Supply Current PORT P=1 Z=50 Ohm CAP ID=C4 C=56 pF RES ID=L3 R=0 Ohm IND ID=L1 L=33 nH CAP ID=C5 C=56 pF PORT P=2 Z=50 Ohm CAP ID=C12 C=5.6 pF SUBCKT ID=U1 NET="EC1089B" C12 should be placed at the silk screen marker "F" on the WJ evaluation board. The capacitor should be placed 14 @ 0.9GHz from pin 1. CAP ID=C13 C=1.0 pF C13 should be placed at the silk screen marker "8" on the WJ evaluation board. The capacitor should be placed 19 @ 0.9GHz from pin 3. Measured parameters were taken at 25 C. OIP3 vs. Frequency 44 43 OIP3 (dBm) Average CDMA ACPR 40 45 Note: (IS95) ACPR1 measured at 750KHz, Forward 9 Channel 50 55 60 65 70 75 80 85 10 12 14 16 Average output power (dBm) 41 40 39 38 37 600 25 C -40 C +85 C ACPR (dBc) 42 700 800 900 1000 Frequency (.9 GHz Matching) 1100 18 1900 MHz Application Circuit (EC1089B-PCB1900) Typical RF Performance Frequency S21 - Gain S11 - Input Return Loss S22 - Output Return Loss Output IP3 (+11 dBm / tone, 1 MHz spacing) Vcc = +5 V All passive components are of size 0603 unless otherwise noted. 1900 MHz 12.2 dB -15 dB -10 dB +41 dBm +23 dBm 5.9 dB +5 V 160 mA RES ID=L2 R=2700 Ohm PORT P=1 Z=50 Ohm CAP ID=C4 C=56 pF IND ID=L3 L=2.7 nH DIODE1 ID=D1 5.6 V CAP ID=C3 C=1e5 pF size 1206 CAP ID=C2 C=1000 pF size 0805 CAP ID=C1 C=56 pF IND ID=L1 L=18 nH Output P1dB Noise Figure Supply Voltage Supply Current CAP ID=C5 C=56 pF PORT P=2 Z=50 Ohm CAP ID=C7 C=2.4 pF C7 should be placed at the silk screen marker "A" on the WJ evaluation board. The capacitor should be placed 5 @ 1.9GHz from pin 1. SUBCKT ID=U1 NET="EC1089B" CAP ID=C13 C=1.2 pF C13 should be placed at the silk screen marker "7" on the WJ evaluation board. The capacitor should be placed 34 @ 1.9GHz from pin 3. Measured parameters were taken at 25 C. OIP3 vs. Temperature vs. Frequency Average CDMA ACPR 40 45 Note: (IS95) ACPR1 measured at 750KHz, Forward 9 Channel 50 55 60 65 70 75 80 85 10 12 14 16 Average output power (dBm) 45 43 dBm 41 39 37 35 1600 1700 25 C -40 C 85 C ACPR (dBc) 1800 1900 2000 2100 18 Frequency (MHz) Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com December 2004 1/4 Watt, High Linearity InGaP HBT Amplifier EC1089 The Communications Edge TM Product Information 2140 MHz Application Circuit (EC1089B-PCB2140) Typical RF Performance Frequency S21 - Gain S11 - Input Return Loss S22 - Output Return Loss Output IP3 (+10 dBm / tone, 1 MHz spacing) Vcc = +5 V All passive components are of size 0603 unless otherwise noted. 2140 MHz 11.5 dB -15 dB -10 dB +40 dBm +23 dBm 5.4 dB +5 V 160 mA CAP ID=C3 C=1e5 pF size 1206 CAP ID=C2 C=1000 pF size 0805 RES ID=L2 R=2700 Ohm C6 should be placed 19.5 @ 2.14GHz from pin 1. CAP CAP ID=C4 ID=C6 C=56 pF C=1.5 pF DIODE1 ID=D1 5.6 V CAP ID=C1 C=56 pF PORT P=1 Z=50 Ohm IND ID=L1 L=18 nH CAP ID=C5 C=56 pF Output P1dB Noise Figure Supply Voltage Supply Current PORT P=2 Z=50 Ohm CAP ID=C12 C=1.5 pF SUBCKT ID=U1 NET="EC1089B" CAP ID=C13 C=0.8 pF C13 should be placed at the silk screen marker "6" on the WJ evaluation board. The capacitor should be placed 39 @ 2.14GHz from pin 3. C12 should be placed at the silk screen marker "F" on the WJ evaluation board. The capacitor should be placed 33 @ 2.14GHz from pin 1. Measured parameters were taken at 25 C. Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com December 2004 1/4 Watt, High Linearity InGaP HBT Amplifier EC1089 The Communications Edge TM Product Information EC1089B (SOT-89 Package) Mechanical Information This package may contain lead-bearing materials. The plating material on the leads is SnPb. Outline Drawing Product Marking The component will be marked with an "1089" designator with an alphanumeric lot code on the top surface of the package. Tape and reel specifications for this part are located on the website in the "Application Notes" section. MSL / ESD Rating ESD Rating: Value: Test: Standard: Class 1A Passes between 250 and 500V Human Body Model (HBM) JEDEC Standard JESD22-A114 MSL Rating: Level 3 at +235 C convection reflow Standard: JEDEC Standard J-STD-020 Land Pattern Mounting Config. Notes 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135" ) diameter drill and have a final plated thru diameter of .25 mm (.010" ). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees. Thermal Specifications Parameter Operating Case Temperature Thermal Resistance (1) Junction Temperature (2) Rating -40 to +85q C 149q C / W 204q C 1000.0 MTTF vs. GND Tab Temperature 100.0 Notes: 1. The thermal resistance is referenced from the junctionto-case at a case temperature of 85 C. 2. This corresponds to the typical biasing condition of +5V, 160 mA at an 85 C case temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 247 C. 10.0 1.0 60 70 80 90 100 110 Tab Temperature (C) 120 Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com December 2004 1/4 Watt, High Linearity InGaP HBT Amplifier EC1089 The Communications Edge TM Product Information This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260qC reflow temperature) and leaded (maximum 245qC reflow temperature) soldering processes. The plating material on the leads is NiPdAu. EC1089B-G (Green / Lead-free SOT-89 Package) Mechanical Information Outline Drawing Product Marking The component will be marked with an " 1089G" designator with an alphanumeric lot code on the top surface of the package. Tape and reel specifications for this part are located on the website in the " Application Notes" section. MSL / ESD Rating ESD Rating: Value: Test: Standard: Class 1A Passes between 250 and 500V Human Body Model (HBM) JEDEC Standard JESD22-A114 Land Pattern MSL Rating: Level 3 at +260 C convection reflow Standard: JEDEC Standard J-STD-020 Mounting Config. Notes 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135" ) diameter drill and have a final plated thru diameter of .25 mm (.010" ). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees. Thermal Specifications Parameter Operating Case Temperature Thermal Resistance (1) Junction Temperature (2) Rating -40 to +85q C 149q C / W 204q C 1000.0 MTTF vs. GND Tab Temperature 100.0 Notes: 1. The thermal resistance is referenced from the junctionto-case at a case temperature of 85 C. 2. This corresponds to the typical biasing condition of +5V, 160 mA at an 85 C case temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 247 C. 10.0 1.0 60 70 80 90 100 110 Tab Temperature (C) 120 Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com December 2004 |
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